name99 is right — N2P has lost the backside power rail. That has been moved to this “A16” track—it is still projected for 2H 2026, so it isn’t a delay.Probably is correct. Basically taken from the TSMC press release. Following is TSMC graphic (see copyright on the photo) .
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TSMC unveils 1.6nm process technology with backside power delivery, rivals Intel's competing design
TSMC goes angstrom-class nodes.www.tomshardware.com
TSMC is being cautious. They are doing GAA without backside first (N2). Then applying only backside ( N2P) . And only then going to push harder for more density ( I think this is when they are transitioning to High NA EUV fab machines. ). Just doing one substantive change at a time reduces risk. N2P is going to be relaxed enough so they don't run into too many multipatterning problems ( similar to N3E versus N3B) .
There is 20% drop from 20 to 16 but only really getting, at best, 10% . It is getting more and more marketing numbers to cover up the slower ( and increasingly more expensive) changes. The only 20% can hand wave at is the power reduction. ( which will get same speed as last gen ... so how many HPC designers are going to choose that? )
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